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Loan Remission Application (previous version)

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Form number: 1113

This form is to be used for applications relating to the September 1, 2021 – August 31, 2022 award year.

The purpose of the Loan Remission Program is to reduce by 15 percent the student loan debt of any person who completed his or her studies within the normal time limits and who received a bursary under the Loans and Bursaries Program for every award year during that period.

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Print the form, fill it out, then sign and scan it. Use your online file to upload the completed form.

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If you are unable to submit this form digitally you can mail it to us. Print the form, fill it out, sign and mail it to the address shown on the form itself.